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POTTING EPOXY COMPOUND

POTTING EPOXY COMPOUND
POTTING EPOXY COMPOUND
Product Code : ER-01
450 INR
Price And Quantity
Minimum Order Quantity :
10
Unit of Measure :
Kilograms/Kilograms
Price :
450 INR
Product Description
ROOM TEMPERATURE CURING FILLED EPOXY CASTING COMPOUD WITH HARDENER – 555, H – 1655 AND H – 160

EC – 606 is specially developed for void free encapsulation and castings. EC – 606 is available in fuid easy to mix consistency ready for immediate application.

Bond & Bond EC – 606 can be used with any of the room temperature curing hardener such as H – 555, H – 1655 and H – 160.

EC – 606 + H – 555 is a fast curing system with a hard cured mass.

EC – 606 + H – 1655 is a medium curing system with a semi rigid cured mass.

EC – 606 + H – 160 is a slower curing system with a low exotherm and flexible cured mass.

·        Good adhesion to most organic and inorganic materials.
·        Good mechanical and electrical properties combined with good chemical and water resistance.
·        Reduced shrinkage and exotherm.
·        Low coefficient of liner expansion.
·        Increased thermal conductivity.

MIXING RATIO AND PROCESSING

MIXING RATIO, PARTS BY WEIGHT

 

EC – 606                                                                          100                                      100                                      100

H – 555                                                                            5 + 0.5                                 -                                            -

H – 1655                                                                          -                                            8 + 0.5                                 -

H – 160                                                                            -                                            -                                            25 + 1

 

 

Contact Us

111, Shivam Complex, Science City Road, Sola, Ahmedabad, Gujarat, 380060, India
Phone :91-79-27774269