EC â 606 is specially developed for void free encapsulation and castings. EC â 606 is available in fuid easy to mix consistency ready for immediate application.
Bond & Bond EC â 606 can be used with any of the room temperature curing hardener such as H â 555, H â 1655 and H â 160.
EC â 606 + H â 555 is a fast curing system with a hard cured mass.
EC â 606 + H â 1655 is a medium curing system with a semi rigid cured mass.
EC â 606 + H â 160 is a slower curing system with a low exotherm and flexible cured mass.Â· Good adhesion to most organic and inorganic materials.
Â· Good mechanical and electrical properties combined with good chemical and water resistance.
Â· Reduced shrinkage and exotherm.
Â· Low coefficient of liner expansion.
Â· Increased thermal conductivity.
MIXING RATIO AND PROCESSINGMIXING RATIO, PARTS BY WEIGHT
EC â 606 100 100 100
H â 555 5 + 0.5 - -
H â 1655 - 8 + 0.5 -
H â 160 - - 25 + 1
111, Shivam Complex, Science City Road, Sola, Ahmedabad, Gujarat, 380060, India